This is a micro
sim card connector with a height of 1.29mm push-push.
NOTES:
MATERIAL:
Housing: High Temperature Thermoplastic,UL 94V-0.
Contact: Copper Alloy
Shell: SUS
PLATING:
Contact: Contact Area:Au 1u", Solder area: Gold Flash;
Under plate Ni 40u"Min all over
Shell: Plated 30u'' Ni Overall
Solder area: Gold Flash
Electrical:
Current Rating :0.5mA max.
Voltage Rating :50V DC MAX
Ambient Temperature Range :-20°C~+85°C
Storage Temperature Range :-40°C~+70°C
Ambient Humidity Range :95% R.H. Max.
Contact Resistance:100m max.
Insulation Resistance:1000M min./250V DC
Dielectric Withstanding Voltage:500V AC
Mating Cycles:3,000 Insertions
Temperature：260°C ±5°
