How is the self-bouncing SIM card holder produced

                        How is the self-bouncing SIM card holder produced

  When manufacturing SIM card holder self-elastic connector parts, manufacturers first need to prepare molds for
manufacturing insulators and terminals, automatic assembly machines and other production equipment, as well as
electroplating equipment. Then the SIM card holder will carry out the molding process of the insulator through
these equipments, and the stamping work of the manufacturing terminal.


  The metal conductor inside the terminal in the SIM card holder connector is the core part of the terminal,
which transmits power, signals, etc. to other parts in contact, so the metal conductor inside the terminal must
have good conductivity. If the design of the contact is unreasonable, the wrong material is selected, the size
is not up to standard, or the plating layer is not properly treated, it will cause poor contact of the connector
link terminal.


  The terminals of the SIM card holder need to be fixed at a specific position to achieve a stable connection.
If the contact is not perfect or the plug-in life of the product leads to poor contact, the light one will affect
the contact and cause an instantaneous power failure, and the serious one will disintegrate the product.
Product disintegration refers to the normal connection between the plug and the socket due to unreliable structure
due to material, design, process and other reasons in the mated state.


  The basic function of the insulator of the wire terminal of the SIM card holder is to require the contacts to
maintain the correct position for arrangement, and the mutual insulation between the connector and the connector,
and between the connector and the housing. Its insulating parts must have good electrical properties, mechanical
properties and process forming properties. Especially as the requirements of the current electronic components
require higher and higher precision, and with the widespread use of miniaturized terminals, the effective wall
thickness of the insulator is getting thinner and thinner. This puts forward more stringent requirements on
insulating materials, injection mold precision and molding process.