Plating knowledge sharing of SIM card socket connector

                 Plating knowledge sharing of SIM card socket connector

SIM card holder is in the electroplating of electronic connector connectors. As we all know, the contacts of
SIM card holder connector have relatively high electrical performance requirements. The gold plating process
occupies an obvious and important position in the electroplating of SIM card holder connectors. Today, except
for some connectors with materials that use selective gold plating, the gold plating in the remaining pinhole
parts is still carried out by barrel plating and vibration plating. In recent years, the volume development of
connectors has become more and more biased. Due to miniaturization, the quality of gold plating in pinhole parts
is becoming more and more prominent. Users of industrial products also have high requirements for the quality of
the gold layer, and some users are even very picky about the appearance quality of the gold layer.
  CARDCONN electronic believes that the common quality problems of the quality of the gold-plated layer of the
connector are the most critical to improve the quality of the gold-plated connector. The following are common
causes of quality problems.
  1. The color of the gold layer is abnormal

The color of the gold-plated layer of the SIM card socket connector is inconsistent with the normal gold layer color,
or the color of the gold layer of different parts in a supporting product is different.


  2. The impact of impurities in gold-plated raw materials
When the impurities brought in by the chemical materials added to the plating solution exceed the tolerance of the
gold plating solution, it will soon affect the color and brightness of the gold layer. If it is affected by organic
impurities, the gold layer will appear dark and blooming. Hao The position of the darkening and blooming of the Er
cell test piece is not fixed. If it is the interference of metal impurities, the effective range of the current
density will be narrowed. The Hall cell test shows that the low end of the current density of the test piece is not
bright or the high end is not bright. , Reflected on the plated parts, the coating is red or even black, and the
color change in its holes is more obvious.


  3. Gold plating current density is too high


Due to the wrong calculation of the total area of the parts in the plating tank, the value is greater than the actual
surface area, so that the gold plating current is too large, or the amplitude of the gold plating is too small when
vibrating electroplating is used, so that all or part of the gold plating in the tank is rough, visually The gold
layer is reddened.


  4. Gold plating solution aging


If the gold plating solution is used for too long, the excessive accumulation of impurities in the plating solution
will inevitably cause abnormal color of the gold layer


  5. The alloy content in the hard gold coating changes


In order to improve the hardness and wear resistance of the SIM card holder seat, the gold plating of the connector
generally adopts a hard gold plating process, of which gold-cobalt alloy and gold-nickel alloy are used more, when
cobalt and gold-nickel alloy in the plating solution When the content of nickel changes, the color of the gold coating
will change. If the cobalt content in the bath is too high, the color of the gold layer will be reddish. If the nickel
content in the bath is too high, the color of the metal will become lighter.