Analysis of the cause of foaming after high temperature of chip smart card connector

Analysis of the causes of foaming after the SMT smart card connector has passed the high temperature of the placement machine:

1. The product is not sealed well, and the plastic parts of the smart card connector absorb moisture in the air for a long time, and expand and bulge when it is exposed to high temperature after passing through the furnace.

2. The screw of the injection molding machine does not eat the material, and the air is involved in the product. When it passes through the furnace again, the air needs to be discharged and bulged.

3. The plastic raw material particles are not completely melted. After passing through the furnace, the particles are heated and bulged.

4. When injection molding is started, the first 50 molds are not fully ideal because the mold temperature has not reached the ideal state,and these products will also cause excessive high temperature foaming when they are heated. Therefore, the requirements of our operation process are that it needs to be scrapped or processed when manual welding is downgraded, whether there is any leakage to good products.